BGA X Ray Inspection Machine with high quality X ray images Unicomp AX8300
X-ray detection technology for the SMT production testing means brought new changes, it can be said that it is the desire to further improve the level of production technology to improve the quality of production, and will soon find the circuit assembly failure as a breakthrough. It's the best selection for the manufacturer.
| Model | AX8300 |
| Max kV/type | 110 kV(Option90 kV)/Sealed |
| Max.Electron beam power | 25W(Option8W) |
| Focal spot size1 | 7μm |
| System magnification | Up to 1000X |
| Imaging system(Option) | Flat Panel Detector |
| Manipulator | 8-axis with tilt 50 degree |
| Measuring volume | Max load area 300x300mm2 |
| Max.sample weight | 5kg |
| Monitors | 22" LCD |
| Cabinet dimensions | 1100x1100x1650mm |
| Weight | 1700kg |
| Radiation safety2 | <1μSv/hr(<0.1mR/hr)at the cabinet surface 5cm |
| Control | Keyboard/Mouse/Joystick |
| Automated inspection | Standard |
| Primary applications | Chip inspection/Electronic components/Auto parts.etc |
| 1.Focal spot size is a variable.Please consult the unicomp 2.X-ray Safety Commitment:All x-ray machines manufactured by Unicomp Technology meet the FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet x-ray systems.The FDA-CDRH standard for cabinet x-ray systems states that radiation emissions will not exceed.5millirem/hr.2"from any external surface.Our machines are typically 15times less emission. |
X-ray Inspecting Features:
(1) Coverage of process defects up to 97%. Inspectible defects include: Empty solder, Bridge, Solder shortage, voids, components missing, and so on. In particular, the BGA, CSP and other solder joint devices can also be checked by X-Ray.
(2) Higher test coverage. It can check where the naked eye and the online test can not be checked. Such as PCBA was judged fault, suspected PCB inner trace break, X-ray can be quickly checked.
(3) The test preparation time is greatly reduced.
(4) It can observe other means of detection can not be reliably detected defects, such as: Empty soldering, air holes and poor molding and so on.
(5) Double layers board and multi-layer boards only one check (with layered function).
(6) Can provide relevant measurement information, used to evaluate the production process. Such as solder paste thickness, solder joints under the amount of solder.
Inspection Images:
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Unicomp AX8300 BGA X Ray Inspection Machine With Low Test Preparation Time Images
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