SMT PCB X-ray machine high resolution micron focus spot size Unicomp AX7900 for cellphone inside quality and cracks inspection
Description of IC X Ray machine AX7900:
It finds extensive application across multiple sectors such as BGA, CSP, Flip Chip technology, LEDs, Fuses, Diodes, PCBs, Semiconductors, the Battery Industry, small-scale metal casting, electronic connector modules, cables, aerospace components, and the Photovoltaic Industry, among others.
FEATURES of IC Xray machine AX7900:
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Laser Pinpoint Inspection Table of Large Dimensions for Precise Localization
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Exact Control with CNC Programming for Automatic Positioning
- FPD Tilting ±25
- Safely Electromagnetic Interlock
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Fingerprint-based Access Control System
Real-time Radiation Monitoring
Technical Specifications of AX7900
| Item | Definition | Specs |
| System Parameters | Size | 1280(L)x1220(W)x1615(H)mm |
| Weight | 1100kg |
| Power | AC 110/220V, 50/60Hz |
| Power Consumption | 1.0kW |
| X-ray Tube | Type | Sealed |
| Max.Voltage | 0~90kV (Adjustable) |
| Max.Power | 8W |
| Spot Size | 5μm |
| X-ray System | Intensifier | FPD |
| Monitor | 224‘’LCD |
| System Magnification | 600X |
| Detection Region | Max.Loading Area | 520mm x 420mm |
| Max.Inspection Area | 460mm x 400mm |
| X-ray Leakage | <1μSv/h (Meets All International Standards) |
Inspection Images of IC X Ray machine AX7900:
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SMT PCB X-Ray Machine High Resolution Micron Focus Spot Size Unicomp AX7900 For Cellphone Inside Quality And Cracks Inspection Images
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