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110KV High-Resolution X-ray Unicomp AX8300 for Non-Destructive BGA Solder Joint Analysis

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110KV High-Resolution X-ray Unicomp AX8300 for Non-Destructive BGA Solder Joint Analysis

Brand Name : UNICOMP

Model Number : AX8300

Certification : CE, FDA

Place of Origin : China

MOQ : 1Set

Price : can negotiate

Payment Terms : T/T,L/C

Supply Ability : 30 sets per month

Delivery Time : 30 days

Packaging Details : Wooden Case, Waterproof, Anti-collision

Name : Electronics X Ray Machine

Application : SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor

X-ray Tube Type : Closed

X-ray Leakage : < 1uSv/h

Weight : 1345kg

Power Consumption : 0.9kW

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High Resolution Semiconductor X-Ray Inspection Machine AX8300
AX8300 adopts self-developed 110kV high-power micro-focus X-ray source with ultra-fine 2μm resolution. It supports 60° tilting & 360° rotating 2.5D omni-directional non-blind inspection, clearly identifying tiny internal defects of chips and solder joints.
Our Service Commitment
Response to inquiries within 12 hours
Direct manufacturer pricing with competitive rates
Comprehensive one-year warranty with free training and lifetime technical support
Flexible shipping options via air, DHL, FedEx, UPS, and sea freight with tracking provided
Professional after-sales service team
Detailed step-by-step operation manual included
Secure order processing - items shipped after payment confirmation
Key Features

110kV Microfocus x-ray source,


High resolution FPD


X/Y/Z/Tilt Motions (table, tube, FPD)


360° Table Rotation


Angle View up to 70 Degrees


Point and Click Location Navigation


CNC Programming for Multiple Image Inspection Routines


Max Inspection Area 360 x 340mm

Technical Specifications
Category Parameter Specification
System Parameters Size 1200(L) x 1285(W) x 1700(H) mm
Weight 1345 kg
Power 220V±10% 50 Hz/60Hz 4A
Power Consumption 0.9 kW
X-ray Tube Type Closed
Max. Voltage 110 kV
Max. Power 25W
Spot Size 5 μm
Detector Intensifier FPD
Pixel Size 84µm
Pixel Matrix 1536*1536[pixel]
Geometric Magnification 49.8X
Work Station Max. Payload Size 600 mm x 520 mm
Max. Detection Area 420 mm x 440 mm
XYZ-axis travel distance(mm) tube Z-axis 145,detector Z-axis 350
X-ray Leakage <1 μSv/h
Industrial PC Monitor 27"HD 4K display
System OS Windows 11 64-bit
Hard Disk 1TB HDD
RAM 16G
CPU Model i7 6 generation

Product Tags:

5μm X-ray Tube Benchtop X Ray Machine

      

100kV Max Voltage X Ray Inspection Machine

      

360° Rotary Fixture Electronics X Ray Machine

      
Quality 110KV High-Resolution X-ray Unicomp AX8300 for Non-Destructive BGA Solder Joint Analysis for sale

110KV High-Resolution X-ray Unicomp AX8300 for Non-Destructive BGA Solder Joint Analysis Images

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